Japan’s technical goal of developing high-precision manufacturing semiconductor silicon carbide is to achieve mass production in 2025

① Japan’s technical goal of developing high-precision manufacturing semiconductor silicon carbide is to achieve mass production in 2025
Professor Yuji Harachi of Nagoya University in Japan and others developed a method of using artificial intelligence (AI) to produce silicon carbide (SiC) crystals used in the new generation of semiconductors with high precision. This method can reduce the number of crystal defects to one percent of the original, and improve the yield of semiconductor production. The start-up established in June 2021 plans to sell samples in 2022 and achieve mass production in 2025.
② Printed core semiconductor obtained A+round financing
Recently, Guangzhou Yinxin Semiconductor Technology Co., Ltd., the developer of intelligent machine vision recognition image sensor chip, announced the completion of the A+round financing led by Yunqi Capital. According to smart bud data, printed core semiconductor currently has 127 patent applications, and the number of patent applications has shown a rapid growth trend in the past three years. The company mainly focuses on image sensors, pixel units, readout circuits, sensors, pixel arrays and other technical fields.
211130 core report | Japan’s technical goal of developing high-precision manufacturing semiconductor silicon carbide to achieve mass production by 2025
③ Sony Launches Autopilot Lidar Sensor for the First Time
Sony Semiconductor Solutions, a subsidiary of Sony Group, first launched high-performance lidar sensors for vehicles, which will be available in March 2022. The new product IMX459 carries about 100000 10-square-micron pixels on a 6.25mm diagonal chip. Objects at the farthest distance of 300 meters can also measure the distance in units of 15 centimeters, and the price is 15000 yen (about 835 yuan) for one piece.
④ Huawei announces new chip patents
Huawei Technologies Co., Ltd. recently released a patent for “manufacturing methods of chip packaging components, electronic equipment and chip packaging components”, with the publication number of CN113707623A. In this application, the chip is connected with the upper conductive layer and the lower conductive layer of the packaging substrate, so that the heat generated by the chip can conduct two-way conduction and heat dissipation, and the heat dissipation part is set on the upper conductive layer, so that the chip packaging components can achieve better heat dissipation effect.