The interconnection density of multi-chip packaging has increased tenfold. How about Intel’s technical strength?

Recently, according to the foreign media VideoCardz, Intel published an article today, announcing three new technologies that break Moore’s Law. The goal of these technologies is to enable chip technology to continue to develop after 2025.
The interconnection density of multi-chip packaging has increased tenfold. What is Intel’s technical strength?
According to public data, at the IEEE International Conference on Electronic Equipment in 2021, Intel announced that the interconnection density of multi-chip hybrid packaging increased by 10 times, the transistor density increased by 30% – 50%, the new power supply and memory technology and quantum computing chip technology.
Intel described some innovative technologies that have been announced so far, including Hi-K metal gate, FinFET transistor, RibbonFET, etc. In the roadmap, Intel also showed a variety of chip processes, including the Intel 20A process, which further reduced the size of the logic gate, called Gate All Around.
Smart bud experts said that as of the latest, Intel and its affiliates have applied for more than 270000 patents in 126 countries/regions, including about 11602 patents directly related to chips. For directly related chip patents, from the perspective of patent trends, Intel’s patent applications were relatively stable from 2002 to 2010, while Intel’s chip patent applications had a small explosion in 2011.
As far as the patent technology directly related to the ribbon is concerned, Intel has 51 groups of patent applications directly related to the above fields. Intel’s patent applications in the above fields are very scattered, with less than 10 patent applications in recent years. The technology in this field is mainly related to transistors and semiconductors.
(Note: The data included in Smart Bud’s global patent database include patents that have been published in 126 countries/regions. Generally speaking, it takes 4 to 18 months for patents to be queried from application to publication)