Once again, Harbin Institute of Technology announced important lithography technology, and domestic chips are expected to achieve 7nm
The lithography machine has become the biggest bottleneck in China’s chip manufacturing at present. For this reason, China’s chip industry chain has been working together to break this difficulty. The lithography machine technology announced by Harbin Institute of Technology will help break this link, and the advanced technology problems of domestic chips will be solved.
Once again, Harbin Institute of Technology announced important lithography technology, and domestic chips are expected to achieve 7nm
The research and development of lithography machines is very difficult. Although only ASML can produce advanced lithography machines in the world, ASML itself cannot completely complete the whole lithography machine components. It can only complete 10% of the components. Other components need the cooperation of more than 5000 enterprises in more than 20 countries around the world, which shows how long the lithography machine industry chain is.
The progress of China’s lithography machine R&D lags behind other links, precisely because the industrial chain needs to be gradually improved. For well-known reasons, it is difficult for China to buy not only advanced lithography machines, but also components of advanced lithography machines, forcing us to build our own lithography machine industry chain.
Previously, with the support of the domestic industrial chain, a number of lithography machine parts such as dual worktable, objective lens system, laser light source and so on have been gradually solved. This time, the “high-speed ultra-precision laser interferometer” developed by Harbin Institute of Technology is an important technology of the 14nm lithography machine, which can ensure the complex relative position between the mask worktable, dual worktable and objective lens system, and achieve the overall lithography accuracy, It can ensure the chip process accuracy after many components are integrated into the system, which has become one of the last technologies of the lithography machine, and also means that the domestic advanced lithography machine is about to complete the final step.
For the chip manufacturing process, the 14nm lithography machine is not limited to the production of 14nm process, and the process of approaching 7nm can be achieved through multiple exposure technology. In fact, both the front stage of the company and Samsung have not moved from 14nm to 7nm in one step, but have also developed processes such as 10nm and 8nm. Even in the 7nm process, there are 7nm and 7nm EUV, Therefore, it is possible to produce chips with a technology of nearly 7 nm by using a 14 nm lithography machine.
Once again, Harbin Institute of Technology announced important lithography technology, and domestic chips are expected to achieve 7nm
In addition to making efforts in chip manufacturing technology, domestic chips also actively develop small chip technology, which can significantly improve performance by stacking two chips; Packaging chips with different processes and functions together can also significantly improve performance. These technologies are being tried by TSMC and Intel. Because the current silicon chip has reached the limit after reaching 3 nm, the development of chip packaging technology has become a direction of the development of the chip industry.
If the manufacturing process of domestic chips can reach 7 nanometers, plus small chip technology, the performance of domestic chips is expected to be further improved to nearly 5 nanometers. At that time, the biggest obstacle to the development of domestic chips will be completely solved, and the United States plan to use advanced chip technology to hinder the development of China’s scientific and technological system will go bankrupt.
In fact, domestic chips now develop advanced chips in many ways, all of which are based on the existing silicon-based chip technology, while Europe and the United States have developed silicon-based chip technology for nearly a hundred years, which allows them to maintain a leading edge in silicon-based chips. In addition to accelerating the catch up on silicon-based chips, China is also developing more advanced chip technology, such as quantum chips, photonic chips, carbon-based chip technology, etc, This will be an opportunity for Chinese chip to overtake at corners.
In terms of these advanced chip technologies, China has gained some advantages. Since the end of 2022, China has successively prepared to build the world’s first quantum chip production line and photonic chip production line, highlighting China’s breakthrough in advanced chip technology. These advanced chip technologies are accelerating mass production, and once they are commercially available, they will have the strength to catch up with Europe and the United States.
Once again, Harbin Institute of Technology announced important lithography technology, and domestic chips are expected to achieve 7nm
In general, the plan of the United States to hinder the development of China’s chip industry is no longer possible. Instead, it has stimulated the potential of China’s chip industry. In just a few years, breakthroughs have been made in many chip technologies. Chinese chips may break the leading edge of the United States in chip technology in the near future. It is with this in mind that the United States will impose restrictions on many technologies, On the other hand, it just shows that China’s chip has made great progress, which makes it feel threatened.