China has two ways to solve the 7nm and 5nm technological problems, and the bottleneck of chip manufacturing is expected to be broken
China has been able to mass-produce 14nm, 7nm and 5nm advanced technologies, which are limited by the supply of EUV lithography machines, have been hampered. However, many recent news shows that China has found a way to solve the obstacles to advanced technologies, and may soon realize the localization of advanced technologies in China.
China has two ways to solve the 7nm and 5nm technological problems, and the bottleneck of chip manufacturing is expected to be broken
One is the SAQP technology announced by a domestic chip enterprise, which can develop 7nm process using the existing DUV lithography machine, and has successfully developed 10nm process with this technology, proving the feasibility of realizing 7nm with this technology.
SAQP technology is actually a multi-exposure technology. With the existing DUV lithography machine, the final mass production of 7 nanometers through multi-exposure is already verified by TSMC. At that time, in order to ensure the mass production of the 7nm process, TSMC continued the previous chip manufacturing technology, adopted the DUV lithography machine to mass produce the first generation of 7nm process, and then introduced the EUV lithography machine after the mass production of the first generation of 7nm process to develop the second generation of 7nm EUV process.
This technology is undoubtedly the most realistic way for China’s advanced manufacturing process. With domestic chip manufacturing enterprises applying SAQP technology to 10nm, China is expected to accelerate the mass production of 7nm technology. Of course, this technology also has some disadvantages, that is, it may lead to the high cost of 7nm technology, but it is more meaningful to solve 7nm technology for Chinese chips.
Another way is to solve the bottleneck problem of China’s chip manufacturing. Mass production of domestic lithography machines is the most fundamental way. China has also made important progress in this regard. Recently, Harbin Institute of Technology announced a research and development achievement of “high-speed ultra-precision laser interferometer”, and won the first “Gold Chert Award” in the list of Chinese optoelectronic instrument brands, which broke the bottleneck of China’s advanced lithography machines.
China has two ways to solve the 7nm and 5nm technological problems, and the bottleneck of chip manufacturing is expected to be broken
The bottleneck of China’s advanced technology is the lithography machine. China has solved seven major links of chip manufacturing. The lithography machine and photoresist have reached 5 nanometers, the chip packaging has reached 4 nanometers, and other links have also reached 14 nanometers. The lithography machine has been trying to break 28 nanometers.
The difficulty of the lithography machine is so great because it is a long industrial chain. It is understood that ASML has up to 100000 EUV lithography machine parts, which can be produced only with the cooperation of 5000 enterprises in the world. This proves how difficult the technology of the advanced lithography machine is. It is precisely because of the difficulty of the lithography machine, China has been facing difficulties in developing the lithography machine.
However, China also has a lot of accumulation in the field of lithography. China is the only economy in the world that has a more complete industrial chain in the field of lithography. This is because it is difficult for China to obtain the supply of lithography accessories due to the influence of well-known factors. However, it can only rebuild a lithography industry chain by itself. With the efforts of China, China has gradually solved the problem of dual workbenches, laser light sources, objective lens systems, etc, The technology released by Harbin Institute of Technology can achieve high-precision integration of these accessories and complete the final step of optical technology. It can be expected that the domestic advanced lithography machine will soon be mass produced.
China’s progress in chip manufacturing lies in the manufacturing foundation that China has laid for a long time. It is this foundation that enables China to take the lead in making breakthroughs in more advanced photonic chips, quantum chips, and other aspects. It has prepared to build the world’s first production line of photonic chips and quantum chips, and can make breakthroughs in more advanced chip technology. So it is no doubt that China has made progress in silicon-based chip technology step by step.
China has two ways to solve the 7nm and 5nm technological problems, and the bottleneck of chip manufacturing is expected to be broken
China has the largest number of technicians in the world. Since China became the largest manufacturing country in the world in 2010, China has begun to attach great importance to scientific and technological research and development. With China’s increasing efforts in scientific and technological research and development, China has become the first in the number of patent applications in the world for 11 consecutive years. With such a strong foundation, it is not surprising that China can simultaneously promote many aspects of chip technology. I believe that the difficulty of lithography will be solved.