Recognize the reality: if comprehensively sanctioned, our chip capacity is 90nm, not 14nm

As we all know, at present, SMIC International, which has the strongest chip manufacturing capacity in China, has reached 14 nm in its process in 2019, and even many netizens said that there might have been 12 nm as early as possible, but it is just a secret.
Of course, we will not discuss this kind of product that has not been announced to the public. If there is one, it is not clear to anyone. We can only treat it as if it has not been announced to the public. Because if it has not been announced to the public, it will certainly not be able to mass produce.
Recognize the reality: if comprehensively sanctioned, our chip capacity is 90nm, not 14nm
It is also because of the 14nm process that many netizens said that in fact, China Chip is not particularly afraid of sanctions, because at present, chips with processes above 28nm in the world account for more than 75%, while chips with processes above 14nm account for at least 80%.
After 14 nm has been achieved, even if sanctioned, it can meet more than 80% of chip manufacturing. In addition to 3D packaging, chiplet, chip stacking and other technologies, it can partially compensate for the impact of the process. Perhaps after stacking and packaging with multiple 14 nm chips, it can be comparable to 7 nm and 5 nm.
Recognize the reality: if comprehensively sanctioned, our chip capacity is 90nm, not 14nm
Seriously, the idea is very good, but we should recognize the fact that our real chip manufacturing capability is based on all domestic equipment. If it is based on imported equipment, then this capability is a castle in the air. Once it is comprehensively sanctioned, it will fall directly.
So what is our real chip capacity? Let me say a number that may not be acceptable to everyone. It is only 90nm.
How this 90nm comes from is based on the chip manufacturing process that can be realized after the current national semiconductor equipment, and this process depends on the current most backward domestic equipment.
Recognize the reality: if comprehensively sanctioned, our chip capacity is 90nm, not 14nm
This is the most backward domestic equipment, I believe I need not say more. Everyone knows that it is the lithography machine. At present, the capacity of the domestic lithography machine is 90nm.
It is estimated that many people still don’t believe it. Not many We-media say that 45 nm can be achieved through two exposures, and then 22 nm can be achieved through three exposures. How can it become 90 nm?
Don’t be too confident about WeMedia. As shown in the figure below, at present, the ArF lithography machine of ASML can only achieve the accuracy of 65nm at the highest. You must enter the ArFi lithography machine to be lower than 65nm. At present, the domestic lithography machine is still this ArF lithography machine. You know how fake the so-called 22nm is.
Recognize the reality: if comprehensively sanctioned, our chip capacity is 90nm, not 14nm
In fact, in addition to the lithography machine at 90nm, there are also some semiconductor equipment processes at 65nm in China, such as gluing development equipment, photoresist, etc.
So really, once the United States and Western countries sanction Russia, our real chip capacity will only be 90nm, not 14nm.
So you should stay sober. The current situation is tense. Only the ability of national industrialization is truly your own. The ability to rely on imported equipment is not useful at the critical moment, do you think?